Vulnerability · Published Apr 6, 2026 · Assigned by qualcomm
CVE-2026-21372Heap-Based Buffer Overflow in Power Management IC
High 7.8
In plain English
A high-severity heap buffer overflow in Snapdragon from Qualcomm, Inc.. There are no confirmed reports of exploitation so far. The chance it is exploited in the next 30 days is estimated at 0.1% (higher than 1% of all known vulnerabilities).
Severity (CVSS 3.1)7.8High
Exploit odds (30 days)0.1%top 99.2% of all CVEs
Exploited in the wildNo reportsCISA SSVC: none
Attack toolingNoneno public tooling known
Official description
Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.
Affected products (as reported)
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm, Inc. | Snapdragon | CologneFastConnect 6700FastConnect 6900FastConnect 7800QCM5430QCM6490Qualcomm Video Collaboration VC3 PlatformSnapdragon 460 Mobile Platform |
Weakness: CWE-122 · Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H