Vulnerability · Published Aug 6, 2025 · Assigned by qualcomm
CVE-2025-47324Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware
High 7.5
In plain English
A high-severity security flaw in Snapdragon from Qualcomm, Inc.. There are no confirmed reports of exploitation so far. The chance it is exploited in the next 30 days is estimated at 0.2% (higher than 10% of all known vulnerabilities).
Severity (CVSS 3.1)7.5High
Exploit odds (30 days)0.2%top 89.6% of all CVEs
Exploited in the wildNo reportsCISA SSVC: none
Attack toolingNoneno public tooling known
Official description
Information disclosure while accessing and modifying the PIB file of a remote device via powerline.
Affected products (as reported)
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm, Inc. | Snapdragon | QCA7005 |
Weakness: CWE-1230 · Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N