Vulnerability · Published Jul 1, 2024 · Assigned by qualcomm
CVE-2024-21466Integer Underflow (Wrap or Wraparound) in WLAN Host Communication
Medium 6.5
In plain English
A medium-severity security flaw in Snapdragon from Qualcomm, Inc.. There are no confirmed reports of exploitation so far. The chance it is exploited in the next 30 days is estimated at 0.2% (higher than 12% of all known vulnerabilities).
Severity (CVSS 3.1)6.5Medium
Exploit odds (30 days)0.2%top 88.3% of all CVEs
Exploited in the wildNo reportsCISA SSVC: none
Attack toolingNoneno public tooling known
Official description
Information disclosure while parsing sub-IE length during new IE generation.
Affected products (as reported)
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 7800Immersive Home 3210 PlatformImmersive Home 326 PlatformIPQ5300IPQ5302IPQ5312IPQ5332IPQ9008 |
Weakness: CWE-191 · Vector: CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:N/A:L