Vulnerability · Published Sep 16, 2022 · Assigned by qualcomm
CVE-2022-25686
High 7.3
In plain English
A high-severity security flaw in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables from Qualcomm, Inc.. There are no confirmed reports of exploitation so far. The chance it is exploited in the next 30 days is estimated at 0.4% (higher than 36% of all known vulnerabilities).
Severity (CVSS 3.1)7.3High
Exploit odds (30 days)0.4%top 63.6% of all CVEs
Exploited in the wildNo reportsnot in CISA KEV
Attack toolingNoneno public tooling known
Official description
Memory corruption in video module due to buffer overflow while processing WAV file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Affected products (as reported)
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | APQ8017, APQ8053, AQT1000, MSM8917, MSM8953, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, Qualcomm215, SA6155, SA6155P, SA8155, SA8155P, SA8195P, SD 636, SD 675, SD 8 Gen1 5G, SD429, SD439, SD460, SD480, SD632, SD660, SD662, SD665, SD670, SD675, SD678, SD680, SD690 5G, SD695, SD710, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD835, SD855, SD865 5G, SD870, SD888, SD888 5G, SDM630, SDX50M, SDX55, SDX55M, SDXR2 5G, SM4125, SM6250, SM7250P, SM7315, SM7325P, SM7450, SM8475, SM8475P, SW5100, SW5100P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3615, WCN3660B, WCN3680, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835 |