Vulnerability · Published Jan 13, 2022 · Assigned by qualcomm

CVE-2021-30308

High 7.8

In plain English

A high-severity security flaw in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile from Qualcomm, Inc.. There are no confirmed reports of exploitation so far. The chance it is exploited in the next 30 days is estimated at 0.2% (higher than 5% of all known vulnerabilities).

Severity (CVSS 3.1)7.8High
Exploit odds (30 days)0.2%top 94.6% of all CVEs
Exploited in the wildNo reportsnot in CISA KEV
Attack toolingNoneno public tooling known

Official description

Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Affected products (as reported)

VendorProductVersions
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile AQT1000, AR8035, CSRB31024, FSM10056, MDM9150, MDM9250, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCS410, QCS603, QCS605, QCS610, QCX315, SA415M, SA515M, SD 675, SD 8 Gen1 5G, SD 8cx Gen2, SD480, SD660, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD7c, SD845, SD850, SD855, SD865 5G, SD870, SDX12, SDX20, SDX24, SDX55, SDX55M, SDX65, SDXR1, SDXR2 5G, SM6250, SM6250P, SM6375, SM7250P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835

References